Shenzhen Hisilicon Semiconductor Co., Ltd.

ThesynonymHiSilicon(asemiconductorcompanyofHuawei)generallyreferstoShenzhenHiSiliconCo.,Ltd.

HiSiliconMemorabilia

OnMay7,2020,HuaweiHiSilicon’ssalesreached2.67billionyuanTheUSdollaralsoenabledHuaweiHiSilicontoentertheglobalsemiconductorTOP10listforthefirsttime.

OnJune19,2018,ShanghaiHiSiliconCo.,Ltd.,basedontheShanghaiR&DCenter,wasestablished,anditsproductswerelaunchedtothepublicmarketforthefirsttime.

InJanuary2017,Kirin960wasselectedasthe"BestAndroidPhoneProcessorof2016"byAndroidAuthority.

InOctober2016,HiSiliconreleasedtheKirin960,whichhasaGPUthatis180%higherthanthepreviousgeneration,andismainlyequippedwithHuaweimate9.

OnFebruary23,2016,HuaweiKirin950wontheGTIInnovativeTechnologyProductAwardatthe2016MobileWorldCongress.

InMay2015,HuaweiHiSiliconannouncedthecompletionofLTECat.11trialswithQualcomm,withamaximumdownlinkrateof600Mbps.

InApril2015,HiSiliconreleasedtheKirin935,whichismainlyequippedwiththeHuaweiP8high-endversionandHonor7.

In2015atMWC,HiSiliconreleaseda64-bit8-corechip,HiSiliconKirin930,whichismountedonHonorX2andHuaweiP8(someversions).

OnDecember3,2014,HiSiliconreleaseda64-bit8-corechip-Kirin620(kirin620),whichisequippedwithHonorPlay4X/4CandHuaweiP8YouthEdition.

OnOctober13,2014,HiSiliconreleasedtheHiSiliconKirin928chip,anditwasinstalledintheHuaweiHonor6ExtremeEdition

OnSeptember4,2014,HiSiliconreleasedthesuperocta-coreHiSilicon925chip,4ARMA7cores,4ARMA15cores,plusacoprocessor,built-inbasebandtosupportLTECat.6standardnetwork,equippedwithHuaweimate7,Honor6Plus

June2014HiSiliconReleasedtheocta-coreHiSiliconKirin920chip,andlauncheditonHuaweiHonor6thatmonth.

InMay2014,HiSiliconreleasedthequad-coreKirin910T(kirin910T),equippedonHuaweiP7.

InFebruary2012attheCESconferenceinBarcelona,​​HiSiliconreleasedthequad-coremobilephoneprocessorchipK3V2,anditwaslaunchedwithAscendD

InJune2008,HiSiliconparticipatedinthe2008TaipeiInternationalComputerExhibition(COMPUTEXTAIPEI).)

InMarch2008,HiSiliconreleasedtheworld'sfirstultra-low-powerDVB-Csinglechipwithbuilt-inQAM

InMarch2008,HiSiliconparticipatedinthe16thChinaInternationalRadioandTelevisionInformationNetworkExhibition(CCBN2008)

InNovember2007,HiSiliconparticipatedinthe2007ChinaInternationalSocialSecurityProductsExpo

InAugust2007,HiSiliconparticipatedinGDSFCHINA2007

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InAugust2007,HiSiliconparticipatedinICChina2007

InMarch2007,HiSiliconparticipatedinthe15thChinaInternationalRadioandTelevisionInformationNetworkExhibition(CCBN2007)

InOctober2006,HiSiliconparticipatedinthe2006ChinaInternationalSocialPublicSafetyProductsExpo

InJune2006,HiSiliconlaunchedthepowerfulH.264videocodecchipHi3510attheTAIPEICOMPUTEXexhibition

InJune2006,HiSiliconparticipatedinthe10thChinaInternationalSoftwareExpoin2006

InNovember2005,HiSiliconparticipatedinthesecurityexhibition,Mr.Aigaveaspeechtomanysecuritymanufacturers

InOctober2004,ShenzhenHiSiliconSemiconductorCo.,Ltd.wasregisteredandthecompanywasformallyestablished.

Attheendof2003,HiSilicon’sfirsttensofmillionsofgate-levelASICsweresuccessfullydeveloped

In2002,HiSilicon’sfirstBlockCOTchipwassuccessfullydeveloped

In2001,WCDMAbasestationchipwassuccessfullydeveloped

In2000,HiSilicon’sfirstmillion-gateASICwassuccessfullydeveloped

1998HastySuccessfuldevelopmentofadigital-analoghybridASIC

In1996,HiSilicon’sfirst100,000-gateASICwassuccessfullydeveloped

In1993,HiSilicon’sfirstdigitalASICwassuccessfullydeveloped

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In1991,HuaweiASICDesignCenter(thepredecessorofShenzhenHiSiliconSemiconductorCo.,Ltd.)wasestablished

HonorsandContributions

InJune2014,theworld’sfirstCat6chipwaslaunched——HisiliconKirin920.

InJune2009,itlaunchedtheK3platformusingtheMobilesmartoperatingsystem.

InApril2006,itpassedISO9001certification.

InFebruary2006,itpassedtheShenzhenHigh-techEnterpriseQualificationCertification.

InDecember2005,itwasrecognizedasanintegratedcircuitdesignenterprise.

InOctober2005,itpassedthecertificationofdesignatedunitsfortheproductionofcommercialcryptographicproducts.

InJanuary2005,thefirstself-developed10GNP(NetworkProcessor)waslaunchedinChina.

InOctober2004,320Gswitchingnetworkchipsand10Gprotocolprocessingchipsweresuccessfullydeveloped,markingthatHiSiliconhasmasteredthecorechiptechnologyofhigh-endrouters.

December2003,undertookthedevelopmentofthethird-generationmobilecommunicationdedicatedchips(chipsets)forkeybreakthroughprojectsinkeyareasofGuangdongProvince,whichwillbeusedinWCDMAterminals.

InNovember2003,theworld'sleadinghigh-endopticalnetworkchipwaslaunched.Thechipusesa0.13umprocesswithadesignscaleofmorethan13milliongates.HiSiliconhasmasteredthecorechiptechnologyintheopticalnetworkfieldandhasbeguntotakethelead.

InJuly2003,undertookthedevelopmentofcorerouterchipsfortheNational863Project,providinghigh-endroutersandhigh-endEthernetswitcheswithswitchingnetworkchipsandIPprotocolprocessingchipswithprocessingcapabilitiesof320Gandabove.

InMarch2001,thefirstdomesticWCDMAbasestationpackagewaslaunched,markingthatHiSiliconwasattheforefrontof3Gtechnology.

InApril2020,itwasselectedasoneofthetop200Chineseimportcompaniesin2019.

OnAugust4,2020,HiSiliconrankedNo.1amongthetop50Chinesenewinnovativeenterprisesin2020.

Chipproducts

Mobileprocessor

Name

Process

series

CPU

GPU

td>
Mobileprocessor

K3V1

K3V2

40nm

4xA91.4GHz

VivanteGC4000

K3V2E

4xA91.5GHz

Kirin620

28nm

6series

8xA531.2GHz

Mali-450MP4500MHz

kirin910

28nm

9series

4xA91.6GHz

Mali-450MP4533MHz

kirin910T

28nm

9series

4xA91.8GHz

Mali450MP4

Kirin920

28nm

9

4xA151.7GHz+4xA71.3GHz

Mali-T624MP4600MHz

kirin925

28nm

9series

4xA151.8GHz+4xA71.3GHz

Mali-T624

Kirin928

28nm

9series

4xA152.0GHz+4xA71.3GHz

Mali-T628MP4

Kirin930

28nm

9series

4xA532.2-1.9GHz+4xA531.5GHz

Mali628MP4680MHz

Kirin935

28nm

9series

4xA532.2GHz+4xA531.5GHz

Mali-T628

Kirin650

16nm

6series

4xA532.36GHz+4xA531.7GHz

Mali-T830900MHz

kirin659

16nm

6series

4xA532.0GHz+4xA531.7GHz

Mali-T830MP2

Kirin950

16nm

9series

4xA722.3GHz+4xA531.8GHz

MaliT880MP4

kirin955

16nm

9series

4xA722.5GHz+4xA531.8GHz

MaliT880MP4900MHz

Kirin960

16nm

9series

4xA732.4GHz+4xA531.8GHz

MaliG71MP8

p>

kirin710

12nm

7series

4×A732.2GHz+4×A531.7GHz

MaliG51

kirin970

10nm

9series

4xA73+4xA53

Mali-G72MP12

Kirin810

Kirin820

7nm

7nm

8series

8series

2xA762.27GHz+6xA551.88GHz

1*Cortex-A76Based2.36GHz+3*Cortex-A76Based2.22GHz+4*Cortex-A551.84GHz

Mali-G52

Mali-G77

Kirin980

Kirin985

7nm

7nm

9series

9series

2xA762.6GHz+2xA761.92Ghz+4xA551.8Ghz

1*Cortex-A76Based2.58GHz+3*Cortex-A76Based2.40G+4*Cortex-A551.84GHz

Mali-G76MP10

Mail-G77

kirin990

7nm

9series

2xA762.86GHz+2xA762.09GHz+4xA551.86GHz

Mali-G76MP16

td>

Kirin9905G

7nm+EUV

td>

9series

2xA762.86GHz+2xA762.36GHz+4xA551.95GHz

Mali-G76MP16

Kirin9000E

5nm

9series

1xA773.13GHz+3xA772.54GHz+4xA552.04GHz

Mali-G78MP22

kirin9000

5nm

9series

1xA773.13GHz+3xA772.54GHz+4xA552.04GHz

Mali-G78MP24

Communicationbaseband

Name

Communicationprotocol

Communicationbaseband

Barong700

LTETDD/FDD

Barong710

LTEFDD/TDDCat.4

Balong720

LTEFDD/TDDCat.6

td>

Barong730

LTECat.12andCat.13UL

Barong765

LTECat.19

Barong5G01

3GPPRel.15

Barong5000

2G/3G/4G/5Gmulti-mode

AIprocessor

Name

Powerconsumption

AIprocessor

Shengteng310

8W

Shengteng910

350W

ServerProcessor

Name

Architecture

Processing

Core

Frequency

Maximumpowerconsumption

ServerProcessor

Kunpeng920

ARMv8.2

7nm

64

2.6GHz

180W

Networkprocessing

NetworkProcessor

Name

Bandwidth

Networking

CPU

Powerlinetransmissionprotocol

Hardwareengine

Wirelessfrequencyband

Transmissionstandard

WiFi

Security

Lingxiao650

160MHz@E2E

Wi-Fi+PLChybridnetworking

4-coreCortex-A53@1.4GHz

WiFioffloading

TrustZone

td>

Hi6530

Quad-coreCortexA9

G.hngigabitpowerline,PLCTurbo

IPv4/IPv6

p>

2.4GHz&5GHz

802.11ac/a/n,

802.11b/g/n

Competitors

Qualcomm,SamsungElectronics,Nvidia,MediaTek,etc.

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