Pääkategoriat
Virustorjuntakomponentit, elektroniset komponentit, pneumaattiset komponentit, sali-komponentit, flash-komponentit, hydrauliset komponentit, sähkökomponentit, komponentit.
sali
Johdanto
salielementisasemiconductorthatusesthesalieffect.Itisgenerallyusedtodeterminetherotorspeedinamotor,suchasthemagneticDrums,coolingfansincomputers,etc.;isamagneticsensorbasedonthesalieffect,whichhasdevelopedintoadiversefamilyofmagneticsensorproductsandhasbeenwidelyused.
Valmistusmateriaalit
salielementit voidaan valmistaa erilaisista puolijohdemateriaaleista, kuten Ge,Si,InSb,GaAs,InAs,InAsP,ja monikerroksisista puolijohteista.
Edut
sali-laitteilla on monia etuja ja niiden rakenne on vankka. Pienikokoinen, kevyt, pitkäikäinen, helppo asentaa, alhainen virrankulutus, korkea taajuus (jopa 1 MHz), tärinänkestävyys, ei pelkää saastumista tai korroosiota pölyn, öljyn, vesihöyryn ja suolasuihkeen takia.
Hydraulinen
Luokittelu
Hydraulikomponentit sisältävät pääasiassa yksitieventtiilin,paineenalennusventtiilin,ylivirtausventtiilin,paineensäätöventtiilin,virtauksensäätöventtiilin,hydraulisylinterihydrauliikkapumput,hydrauliset moottoriventtiilit (paineventtiilit,virtausventtiilit,vaihtoventtiilit),hydrauliset tarvikkeet (öljynsuodatinlaitteet,sulkuventtiilit,sulkuventtiilit,sulkuventtiilit,sulkuventtiilit ja tiivistysventtiilit.
Käyttää
Hydraulinencomponentshaveawiderangeofuses.Hydraulinenpressmanufacturers,aswellasmetallurgicalsteelcompanies,usethemmoreoften,andtheyareanimportantpartofautomationequipment.
Pneumaattinen
Luokittelu
Pneumaattiset komponentit jaetaan yleensä seuraaviin: sylinteri, pikaliitin, sylinterin virtauksen rajoitin, pneumaattinen viiveventtiili, suodatin, PU-letku, miniliitokset, yleiskierteiset liitokset, paineilmaventtiilit, kuivaimet, paineenalennusventtiilit+magneettiventtiilin ohjaus+sylinterit, jne.
Sovellus
Pneumaattinencomponentscanbeusedin:foodindustry,clothingindustry,printingindustry,semiconductorindustry,automobileindustry.Ifyouputthepneumaticairsourcepart(compressedair,vacuum,airFilterunit);controlpart(varioussolenoidvalves,pneumaticvalves,manualvalves,speedcontrolvalves,on-offvalves,reliefvalves,pressurereducingvalves),executiveparts(pneumaticsuctioncups,cylinders,pneumaticfingers,etc. )yhdistettynäIfyoulookatit, tulet huomaamaan, ettäsähköenergialla toteutettu liike voidaan toteuttaa pneumaattisesti.
Haitat
However,thedisadvantagesofpneumaticcomponentsarepoorpositioningaccuracy(duringoperation)andhighnoise.
InFLASHanimationproduction,weoftenneedtousecomponents.
Määritelmä
Acomponentisagraphic,buttonorasmallanimationthatcanberepeatedlytakenout.Thesmallanimationinthecomponentcanbeplayedindependentlyofthemainanimation,andeachcomponentcanbemultipleindependentAcombinationofelements.Toputitbluntly,acomponentisequivalenttoareusabletemplate,andusingacomponentisequivalenttoinstantiatingacomponententity.Theadvantageofusingcomponentsisthattheycanbereused,reducingfilestoragespace.
Toiminto
TherearemanytimesintheFLASHthatneedtoreusematerials,thenwecanconvertthematerialsintocomponents,orsimplycreatenewcomponents.Inordertofacilitaterepeateduseoreditandmodifyagain.Componentscanalsobeunderstoodasoriginalmaterials,whichareusuallystoredinacomponentlibrary.Theelementcanbemodifiedagain,butmodifyingtheelementinthescenewillnotmodifythepropertiesoftheelementitself.
Komponenteissa on yleensä kolme muotoa: Painikekomponentit.
Itisasegmentofflashanimation,whichcanbeplayedindependentlyofthemainanimation.Themovieclipcanbeanintegralpartofthemainanimation.Whenthemainanimationisplayed,themovieclipcomponentwillalsobeplayedinaloop.
Themoviefragmentsintheflashmoviehavetheirowntimelineandattributes.Itisinteractiveandisthemostversatileandfunctionalpart.Itcancontainexamplesofinteractivecontrols,sounds,andothermovieclips,anditcanalsobeplacedinthetimelineofthebuttoncomponenttocreateananimationbutton.
Buttoncomponents:interactivecontrolbuttonsusedtocreateanimationstocorrespondtothemousetime(suchasclick,release,etc.).Thebuttonhasfourdifferentstateframesofup,over,down,andhit.Differentcontentcanbecreatedonthedifferentstateframesofthebutton.Itcanbeastillgraphicoramovieclip,anditcangivethebuttonfieldtime.Interactiveactionsmakethebuttonshaveinteractivefunctions.
Graphiccomponent:Agraphiccomponentisareusablegraphic,whichcanbeacomponentofamovieclipcomponentorascene.Thegraphicelementisastillpicturewithoneframe,whichisoneofthebasicelementsformakinganimation,butitcannotaddinteractivebehaviorandsoundcontrol.
Graphicelementsinflasharesuitableforthereuseofstaticimages,ortocreateanimationsassociatedwiththemaintimeline.Itcannotprovideaninstancename,norcanitbereferencedinActionScript.
Method1:Createanewblankcomponent,andtheninsertthecontentofthecomponentinthecomponenteditingstate.Selectthemenu"Insert"->"NewComponent"orpressthekeyboardctrl+F8tocreateanewcomponent.
Method2:Convertobjectsonthesceneintocomponents.Selectanexistingcomponentinthescene,clicktherightmousebutton,andselectConverttocomponent.
Menetelmä 3: Muuntaminen komponenteiksi.
Eachcomponenthasamaximumpowerlimit,whetheritisanactivedevice(suchasamplifier)orPassivecomponents(suchascablesorfilters).Understandinghowpowerflowsinthesecomponentshelpstohandlehigherpowerlevelswhendesigningcircuitsandsystems.
Howmuchpowercanithandle?Thisisanunavoidablequestiontomostofthecomponentsinthetransmitter,andthequestionisusuallypassivecomponents,suchasfilters,Couplerandantenna.However,withthepowerlevelofmicrowavevacuumtubes(suchastravelingwavetubes(TWT))andcoreactivedevices(suchassiliconlaterallydiffusedmetaloxidesemiconductor(LDMOS)transistorsandgalliumnitride(GaN)fieldeffecttransistors(FET))Wheninstalledinawell-designedamplifiercircuit,theywillalsobelimitedbythepowerhandlingcapabilitiesofcomponentssuchasconnectorsandevenprintedcircuitboard(PCB)materials.Understandingthelimitationsofthedifferentcomponentsthatmakeupahigh-powercomponentorsystemcanhelpanswerthislong-standingquestion.
Thetransmitterrequiresthepowertobewithinthelimit.Generallyspeaking,theselimitsarestipulatedbygovernmentagencies,suchasthecommunicationstandardsestablishedbytheFederalCommunicationsCommission(FCC)intheUnitedStates.Butin"unregulated"systems,suchasradarandelectronicwarfare(EW)platforms,therestrictionsaremainlyduetotheelectroniccomponentsinthesystem.
Whencurrentflowsthroughthecircuit,partoftheelectricalenergywillbeconvertedintoheat.Circuitsthathandlelargeenoughcurrentswillheatup-especiallyinplaceswithhighresistance,suchasdiscreteresistors.Thebasicideaofsettingpowerlimitsforcircuitsorsystemsistouselowoperatingtemperaturestopreventanytemperaturerisethatmaydamagethecircuitorsystemcomponentsormaterials,suchasthedielectricmaterialsusedinprintedcircuitboards.Interruptionswhencurrent/heatflowsthroughthecircuit(suchaslooseorsolderedconnectors)canalsocausethermaldiscontinuitiesorhotspots,whichcancausedamageorreliabilityissues.Temperatureeffects,includingdifferencesinthecoefficientofthermalexpansion(CTE)betweendifferentmaterials,canalsocausereliabilityproblemsinhigh-frequencycircuitsandsystems.
Theheatalwaysflowsfromthehighertemperatureareatothelowertemperaturearea.Thisprinciplecanbeusedtotransfertheheatgeneratedbythehigh-powercircuitawayfromtheheatsource,suchasatransistororTWT.Ofcourse,theheatdissipationpathfromtheheatsourceshouldincludeadestinationcomposedofmaterialsthatcanclearordissipateheat,suchasametalgroundlayeroraheatsink.Inanycase,thethermalmanagementofanycircuitorsystemcanonlybeoptimallyachievedifitisconsideredatthebeginningofthedesigncycle.
Generally,thermalconductivityisusedtocomparetheperformanceofmaterialsusedtomanageheatinRF/microwavecircuits.Thisindexismeasuredbythepower(W/mK)appliedpermeterofmaterialperdegree(inKelvin).Perhapsthemostimportantfactorofthesematerialsforanyhigh-frequencycircuitisthePCBstackup,whichgenerallyhaslowthermalconductivity.Forexample,FR4laminatematerialsoftenusedinlow-costhigh-frequencycircuits,theirtypicalthermalconductivityisonly0.25W/mK.
Incontrast,copper(depositedonFR4asagroundplaneorcircuittrace)hasathermalconductivityof355W/mK.Copperhasalargeheatflowcapacity,whileFR4hasalmostnegligiblethermalconductivity.Inordertopreventhotspotsonthecoppertransmissionline,itisnecessarytoprovideahighthermalconductivitypathfromthetransmissionlinetothegroundplane,heatsinkorsomeotherhighthermalconductivityarea.ThinnerPCBmaterialallowsshorterpathstothegroundplane,becauseplatedvias(PTH)canbeusedtoconnectthecircuittracestothegroundplane.
Ofcourse,thepowerhandlingcapabilityofaPCBisafunctionofmanyfactors,includingconductorwidth,groundplanespacing,andmaterialdissipationfactor(loss).Inaddition,thedielectricconstantofthematerialwilldeterminethecircuitsizeatagivenidealcharacteristicimpedance,suchas50Ω,somaterialswithhigherdielectricconstantvaluesallowcircuitdesignerstoreducethesizeoftheirRF/microwavecircuits.Inotherwords,theseshortermetaltracesmeanthatPCBdielectricmaterialswithhigherthermalconductivityarerequiredtoachievecorrectthermalmanagement.
Underagivenapplicationpowerlevel,circuitmaterialswithhigherthermalconductivityhavealowertemperaturerisethanmaterialswithlowerthermalconductivity.Unfortunately,FR4isnodifferentfrommanyotherPCBmaterialswithlowthermalconductivity.However,theheattreatmentandpowerhandlingcapabilitiesofthecircuitcanbeimprovedbyspecifyingtheuseofPCBmaterialsthathaveahigherthermalconductivitythanFR4atleast.
Forexample,althoughthethermalconductivityofcopperhasnotyetreachedthelevel,severalofRogers’PCBmaterialscanprovidemuchhigherthermalconductivitythanFR4.ThethermalconductivityofRO4350Bmaterialis0.62W/mK,whilethecompany’sRO4360laminatehasathermalconductivityof0.80W/mK.Althoughthereisnosignificantimprovement,itdoeshavetwotothreetimestheheat/powercapacityimprovementcomparedwithFR4stack,whichcanrealizetheeffectivedissipationoftheheatgeneratedbytheRF/microwavecircuit.Thesetwomaterialsareparticularlysuitableforamplifierapplicationswithabuilt-inheatsource(transistor).Theybothhavealowcoefficientofthermalexpansion(CTE)value,sotheycanminimizedimensionalchangeswithtemperature.
Manycommercialcomputer-aidedengineering(CAE)softwaredesignpackagescanmodeltheheatflowthroughtheRF/microwavecircuitunderthegivenapplicationpowerlevelandthegivencircuitparametersettings,includingtheheatofthePCB.Conductivity.Thesesoftwaredesignpackagescontainmanyindividualprograms,suchasSonnetSoftware’selectromagneticsimulation(EM)tool,Fluent’sIcePaksoftware,ANSYS’TASPCBsoftware,andFlomerics’Flothermsoftware.Theyalsoincludemanydesignsoftwaretoolsuites,suchasAgilent'sAdvancedDesignSystem(ADS),ComputerSimulationTechnology(CST)'sCSTMicrowaveStudio,andAWR'sMicrowaveOffice.
ThesesoftwaretoolscanevenbeusedtostudytheimpactofdifferentworkingenvironmentsonthepowerprocessingcapabilitiesofRF/microwavecircuits,suchasthosethatmayoccuratsufficientlyhighpowerlevelsintheaircraft’slowatmosphericpressureorhighaltitudeenvironmentArc.TheseprogramscanalsoimprovethepowerhandlingcapabilitiesofdiscreteRF/microwavecomponentsbymodelingthefielddistributionofenergyflowingthroughcomponents(suchascouplersorfilters).
Ofcourse,PCBmaterialisnottheonlyfactorthataffectsheatflowinRF/microwavecircuitsorsystems.Thelimitationsofcablesandconnectorsonpower/heatinhighfrequencysystemsarealsowellknown.Inacoaxialassembly,theconnectorcanusuallyhandlemoreheat/powerthanthecabletowhichitisconnected,anddifferentconnectorshavedifferentpowerratings.Forexample,thepowerratingoftheN-typeconnectorisslightlyhigherthanthatoftheSMAconnectorwithasmallersize(andhigherfrequencyrange).Theaveragepowerandpeakpowerofcablesandconnectorsarerated,andthepeakpowerisequaltoV2/Z,whereZisthecharacteristicimpedanceandVisthepeakvoltage.Asimplemethodofestimatingtheaveragepowerratingistomultiplythepeakpowerratingofthecableassemblybythedutycycle.
ManycablesupplierssuchasAstrolabhavedevelopedspecialcalculationprogramstocalculatethepowerhandlingcapacityoftheircoaxialcableassemblies.Somecompanies,suchasTimesMicrowaveSystems,providefreedownloadablecalculationprogramsthatcanbeusedtopredictthepowerhandlingcapabilitiesoftheirowndifferenttypesofcoaxialcables.
Itisworthnotingthatthisisanextremelysimplistictreatmentofcomplextopics.Italsodoesnotcovertopicssuchasmaterialbreakdownvoltage,PCBdissipationfactor(dissipationfactor),howthecircuit’spowerhandlingcapacityisaffected,theimpactonPCBmaterialcoefficientofthermalexpansion(CTE)performance,andthedifferenceinheatingeffectsbetweencontinuouswaveandpulsedenergysources.
Incomponents,circuits,andsystems,therearemanycomplexphenomenathatmayaffectthepowerprocessingcapabilities,includingcomponentswithdifferentRF/microwavepowercapabilitiessuchasswitcheswith"on"and"off"states.Inadditiontosoftwareprograms,toolsthatcanbeusedforthermalanalysiscanalsoprovidethermalimagingcapabilitiesbasedoninfrared(IR)technology,whichcanbeusedtosafelystudyheataccumulationincomponents,circuits,andsystems.