Laitteiston kehitys

Kehitysprosessi

1. Selvitä kaikki laitteistovaatimukset, kuten suorittimen prosessointikapasiteetti, tallennuskapasiteetti ja nopeus, I/portaalin kohdistaminen, liitäntävaatimukset, tasovaatimukset ja erityiset piirivaatimukset jne.

2.Developanoverallhardwareplanbasedondemandanalysis,seekforkeycomponentsandtheirtechnicaldata,technicalapproaches,andtechnicalsupport.Itisnecessarytofullyconsidertechnicalpossibilities,reliabilityandcostcontrol,andtodevelopThedebuggingtoolputsforwardclearrequirements,andsamplesofkeycomponentsarerequested.

3.Suorita yksityiskohtainen laitteistosuunnittelu, mukaan lukien laitteistokaavioiden piirtäminen, yhden levyn toiminnalliset lohkokaaviot ja koodaus, PCB-johdotus ja materiaalien, tuotantoasiakirjojen (Gerber) ja materiaalisovellusten kehityslaskujen viimeistely.

4.AfterreceivingthePCBboardandmaterials,arrangetoweld2~4singleboardsforsingleboarddebugging,commissioningeachfunctionintheprincipledesign,modifytheschematicdiagramandrecordifnecessary.

5.Softwareandhardwaresystemjointdebugging,generalsingleboardrequiresthecooperationofhardwarepersonnelandsingleboardsoftwarepersonnel.Aftersingleboarddebugging,therearesomeadjustmentsinprincipleandPCBwiring,andthesecondboardisrequired..

6.Internalacceptanceandtransfertopilottest,duringtrialproduction,followuptheproblemsoftheproductionline,activelyassisttheproductionlinetosolvevariousproblems,improvethegoodrate,andpavethewayformassproduction.

7.Smallbatchproduction.Aftertheproducthaspassedtheinspection,itisnecessarytocarryoutsmallbatchproduction,findouttheproductionprocess,testtheprocess,andprepareformassproduction.

8.Massproduction.AfterthesmallbatchproductionhasverifiedthatthereisnoproblemwiththeR&D,testing,andmassproductionprocessofafullsetofelectronicproducts,massproductioncanbestarted.

Asiakirjan tiedot

1Johdatus laitteistokehitysdokumentaation spesifikaatiotiedostoon

Tostandardizethewritingofdocumentsinthehardwaredevelopmentprocess,clarifytheformatandcontentofthedocument,andspecifythehardwaredevelopmentThelistofdocumentsrequiredintheprocessistoformulatethe"HardwareDevelopmentDocumentPreparationSpecification"correspondingtothe"HardwareDevelopmentProcess".Developersoftenmisssomecontentthatshouldbewrittenwhenwritingdocuments,andthecompilationspecificationalsohasacertainpromptingeffectwhendeveloperswritedocuments.The"HardwareDevelopmentDocumentationSpecification"isapplicabletothedocumentationofthedevelopmentandtestingphasesofthehardwaresystemoftheprojectgroupingproject.TheCCPliststhespecificationsofthefollowingdocuments:

2Yksityiskohtainen laitteistokehitysdokumentaation erittely

1、Laitteistovaatimusspesifikaatio

Thehardwarerequirementspecificationdescribesthehardwaredevelopmentgoals,basicfunctions,basicconfiguration,mainperformanceindicators,operatingenvironment,constraintconditions,developmentfundsandprogressrequirements,anditsrequirementsarebasedonproductspecificationsInstructionsandsystemrequirementsinstructions.Itisthebasisfortheoverallhardwaredesignandtheformulationofthehardwaredevelopmentplan.

Thespecificcontentsinclude:systemengineeringnetworkingandinstructionsforuse,basicfunctionsandmainperformanceindicatorsoftheoverallhardwaresystem,andbasichardwaresub-systemsFunctionsandmainperformanceindicators,aswellasthedivisionoffunctionalmodules,etc.

2.Laitteiston kokonaissuunnitteluraportti

Thehardwareoveralldesignreportisareportproducedaftertheoveralldesignaccordingtotherequirementsoftherequirementsspecification.Itisthebasisforthedetailedhardwaredesign.Thepreparationoftheoverallhardwaredesignreportshouldincludethefollowing:

Theoverallsystemstructureandfunctiondivision,thesystemlogicalblockdiagram,thelogicalblockdiagramofthefunctionalmodulesthatmakeupthesystem,thecircuitstructurediagramandthesingleboardcomposition,thesingleboardlogicalblockdiagramandCircuitstructurediagram,aswellasreliability,safety,electromagneticcompatibilitydiscussionandhardwaretestplans,etc.

3.Yhden laudan suunnittelusuunnitelma

Thisdocumentshouldbeissuedaftertheoveralldesignplanofthesingleboardisdetermined.Theoveralldesignplanofthesingleboardshouldincludethesingleboardversionnumber,Theboard'spositioninthewholemachine,developmentpurposeandmainfunctions,singleboardfunctiondescription,singleboardlogicalblockdiagramanddescriptionofeachfunctionmodule,singleboardsoftwarefunctiondescriptionandfunctionmoduledivision,simpledefinitionofinterfaceandrelationshipwithrelatedboards,mainperformanceIndicators,powerconsumptionandadoptionstandards.

4. Yksityiskohtainen yhden levyn laitteistosuunnittelu

Whenthesingle-boardhardwareentersthedetaileddesignstage,adetailedsingle-boardhardwaredesignreportshouldbesubmitted.Thedetaileddesignofthesingle-boardhardwareshouldfocuson:thesingle-boardlogicblockdiagramanddetaileddescriptionofeachfunctionalmodule,theimplementationofeachfunctionalmodule,addressallocation,controlmode,interfacemode,memoryspace,interruptmode,interfacepinsignaldetailsDefinitions,timingdescriptions,performanceindicators,indicatordescriptions,externalwiringdefinitions,programmabledevicediagrams,functionalmoduledescriptions,schematicdiagrams,detailedbillsofmaterials,andsingleboardtestinganddebuggingplans.Sometimesthehardwareandsoftwareofasingleboardareseparatelydevelopedbytwodevelopers.Therefore,thedetaileddesignofthesingleboardhardwareprovidesadetailedguideforthesoftwaredesigneratthistime.Therefore,thedetaileddesignreportofthesingleboardhardwareisveryimportant.Inparticular,addressallocation,controlmode,interfacemode,andinterruptmodearethebasisforprogrammingsingle-boardsoftwareandmustbewrittenindetail.

5.Yksilevyisten ohjelmistojen yksityiskohtainen suunnittelu

Afterthesingle-boardsoftwaredesigniscompleted,adetailedsingle-boardsoftwaredesignreportshouldbecompletedaccordingly,andthecompletionofthesingle-boardsoftwareprogrammingshouldbelistedinthereportLanguage,compilerdebuggingenvironment,hardwaredescriptionandfunctionalrequirementsanddatastructure,etc.Itshouldbeparticularlyemphasizedthatthedetaileddesigndetailsshouldbelistedindetail,includinginterrupts,mainroutines,subroutinefunctions,entryparameters,exitparameters,localvariables,functioncallsandflowcharts.Inthedescriptionofthecommunicationprotocol,itshouldbeexplainedwhichdocumentsdefinethephysicallayer,linklayercommunicationprotocolandhigh-levelcommunicationprotocol.

6.Singleboardhardwareprocessdebugging-asiakirja

Duringthedevelopmentprocess,everytimeaPCBboardisinvested,theengineershouldsubmitaprocessdocumentsothatthemanagementcanunderstandtheprogressandconductanevaluation.Inaddition,italsoleavesareferencevaluetechnicaldocumentforotherrelevantengineers.ThisdocumentshouldbemadeeverytimeaPCBboardisinvested.Thisdocumentshouldincludethefollowingcontent:thedivisionofsingle-boardhardwarefunctionmodules,thedebuggingprogressofeachmoduleofthesingle-boardhardware,theproblemsandsolutionsduringdebugging,theoriginaldatarecord,thesystemplanmodificationinstructions,thesingleboardplanmodificationinstructions,thedevicereplacementinstructions,Schematicdiagram,PCBdiagrammodificationdescription,programmabledevicemodificationdescription,debuggingworkstagesummary,debuggingprogressdescription,nextstagedebuggingplanandtestplanmodification.

7.Yhden levyn ohjelmistoprosessoi virheenkorjausasiakirjat

Collectthesingle-boardsoftwareprocessdebuggingdocumentsonceamonth,orcollectafterthedebugging(referringtolessthanonemonth),asclearaspossibleandcompletethelistTheprocessofsoftwaredebuggingandmodificationispresented.Thesingle-boardsoftwareprocessdebuggingdocumentationshallincludethefollowingcontent:thedivisionofsingle-boardsoftwarefunctionmodulesandthedebuggingprogressofeachfunctionmodule,theproblemsandsolutionsofsingle-boardsoftwaredebugging,thedebuggingplanforthenextstage,andthemodificationofthetestplan.

8.Single-boardsystemjointdebugging-raportti

Whentheprojectentersthesingle-boardsystemjointdebuggingstage,asingle-boardsystemjointdebuggingreportshouldbeissued.Thesingle-boardsystemjointdebuggingreportincludesthesecontents:systemfunctionmoduledivision,systemfunctionmoduledebuggingprogress,systeminterfacesignaltestoriginalrecordandanalysis,systemjointdebuggingproblemsandsolutions,debuggingskillscollection,overallmachineperformanceevaluation,etc.

9.Singleboardhardwaretestasiakirja

Afterthesingleboardisdebugged,beforeapplyingforinternalacceptance,self-testshouldbecarriedouttoensurethateachfunctioncanberealized,andeachindicatorCanbesatisfied.Aftertheself-testiscompleted,asingle-boardhardwaretestdocumentshouldbeissued.Thesingle-boardhardwaretestdocumentincludesthefollowing:thedivisionofsingle-boardfunctionalmodules,thedesignofinputandoutputsignalsandperformanceparametersofeachfunctionalmodule,thedeterminationofthetestpointsofeachfunctionalmodule,andtheoriginalmeasurementofeachtestreferencepoint.Recordingandanalysis,theoriginalrecordandanalysisofthehigh-speedsignallinetestintheboard,theoriginalrecordandanalysisofthesystemI/Oportsignallinetest,andtheanalysisoftheoverallboardperformancetestresults.

10. Laitteistotietokirjasto

Inordertosharetechnicaldata,wehopetoestablishashareddatalibrary.EachboardhopestoincludethemostvaluableandcharacteristicdataintoThislibrary.Thehardwareinformationlibraryincludesthefollowingcontent:typicalapplicationcircuit,characteristiccircuit,characteristicchiptechnologyintroduction,characteristicchipuseinstruction,driverflowchart,sourceprogram,relatedhardwarecircuitdescription,PCBlayoutprecautions,singleboarddebuggingTypicalandsolution,softwareandhardwaredesignanddebuggingskills.

Follow-upprocess

Aftertheelectronicproductisdeveloped,itgenerallyneedstohaveahousingorstructuretofixtheelectronicproduct.Undernormalcircumstances,itwillnotdirectlyholdthecircuitboard.Use,sotherearealsoprocessessuchasmolddesign,shapedesign,moldopening,andtrialassembly.Thereareaboutmorethan20processestocompleteanelectronicproductresearchanddevelopmentprocess,andthemorecomplicatedonesareevenmorecomplicated.

Itcanbesaidthateachelectronicproductdevelopmenthasitsowncharacteristics,otherwiseitwillbecomethesameelectronicproduct.Therefore,whenencounteringspecificelectronicproductdevelopment,itisnecessarytoconductaspecialanalysisbasedonitsfunctionalcharacteristics..